Template Based High Packing Density Assembly for Microchip Solid State Cooling Application
نویسندگان
چکیده
100% dry assembly using shape matching and van der Waals attraction for parts transfer has been performed to achieve high density parts packing (up to 92%) of thermoelectric cooling components. The feasibility of this approach has been examined for component sizes across a range of 130800μm.
منابع مشابه
Template Based Assembly for Solid State Cooling
This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400-800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance. INTRODUCTION Inertial force (mass of the assembled parts) plays a critical role for part alignment and orienting in a dry microassemb...
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تاریخ انتشار 2006